Corning’s EDGE™ Rapid Connect is a rugged, high-density cabling solution optimized to let you complete data center interconnects faster than ever. Our all new case study is loaded with real world metrics and examples, resulting in a savings of up to 70% on installation time when installing trunk cables between data center buildings.
Download your Case Study today!
Enable fast, easy data center interconnect (DCI) deployments with the Corning EDGE™ Rapid Connect Solution – one step in Corning’s journey toward a Data Center in a Day.
Designed to facilitate DCI deployments and connections between data halls, EDGE™ Rapid Connect Solution utilizes trunk cables with the all-new Fast Track MTP® Connector. Developed by Corning and US Conec, the Fast Track MTP® Connector’s small profile enables preterminated trunks with a reduced diameter pulling grip that can be pulled through crowded conduits.
In outside plant environments, the smaller two-inch diameter pulling grip allows EDGE™ Rapid Connect Solutions to be easily pulled through existing conduits – streamlining installation and giving data center operators a new path to extreme density. The grip is waterproof, capable of handling up to 600 pounds of pulling tension, and compatible with MaxCell innerduct. Best of all, installation is straightforward – no special processes or equipment required.